Overview

Company Profile

Company Description

NanoSeeX develops the first in-line and non-destructive 3D critical dimension(CD) metrology system
Run by a team from ITRI which develops X-ray metrology tool for advanced node monitoring since 2016
Potential applications of the technology：

Advanced 3D Transistor

The team is developing a tool for offering high precision & accuracy measurements of the key 3D CD features such as etch back, inner spacer, STI smiling and multi-thickness processes.

EUV Mask & Pellicle

Interlayer & thickness yeild quality control, and successfully identified EUV reflectivity (EUVR) variations corresponding to a 2% yield difference across different products.

Photonics

Including 3D component structures for leading international AR and VR optical manufacturers

Corporate Details

Headquarter：Taiwan, Hsinchu
Inception：A spin-off from ITRI in 2023/7/17
Status：Pre-beta tool stage, 10 employees
Key Executive：Dr. Daniel Liu CEO, Dr. Kai-Hao, Chang CTO, Dr. Bo-Ching He COO
Company Registered Capital：300 million New Taiwan Dollars
Current Paid-in Capital：160 million New Taiwan Dollars

Vision

Redefining Xcellence in Nanotechnology

NanoSeeX leads semiconductor innovation worldwide, redefining chip manufacturing with cutting-edge solutions.

Our indigenous high-end equipment and advanced material analysis, coupled with multiphysics models and AI-driven machine learning (patented), drive the forefront of semiconductor technology.

Leveraging sub-nanometer X-rays, we achieve unrivaled 0.1 nm resolution, unveiling intricate 3D nanostructures devices (patented). Empowering chipmakers for faster, energy-efficient microchips, we stand as the premier choice for industry partnerships and acquisitions.